SL 1000GB
High Precision, High rigidity Ceramic and Quartz grinding machine.
Purposely Designed for semi-conductor manufacturing market.
Specification & Technical Data
Capacity
Swing Over the Bed
39.38″
Swing Over the Cross Slide
32.29″
Max. Grinding Diameter
32.29″
Max. Grinding Length
13.39″
Spindle
Spindle speed
1,000 rpm
Spindle Nose
A2-6
Spindle Bore
3″
Main Spindle motor (Cont./Max)
10.06/14.76
Travel
Axis Travel (X/Z)
20.08″/19.69″
Guide ways
Box Guide
Rapid Traverse Rate (X/Z)
629.93/629.93 inch/min
Grinding Spindle
Spindle Speed
6,000 rpm
Spindle Motor (cont/max)
3.7/5.5 hp
Tool Shank Type
BBT40
Spindle Lubrication and Cooling
Grease encapsulation
ATC (Optional)
Max Number of Tools
2
Tool Change Method
Double Arm Swing
General
Floor Space (L×W)
102.09″ x 78.86″
Machine Weight A [B]
10,803 lbs.
Controller
Fanuc 0i-TF+
Specifications subject to change without notice.