PL 800GB
High Precision, High rigidity Ceramic and Quartz grinding machine.
Purposely Designed for semi-conductor manufacturing market.
Specification & Technical Data
Capacity
Swing Over the Bed
31.5″
Swing Over the Cross Slide
25.6″
Max. Grinding Diameter
25.6″
Max. Grinding Length
5.91″
Spindle
Spindle speed
2,200 rpm
Spindle Nose
A2-6
Spindle Bore
2.41
Main Spindle motor (Cont./Max)
14.76/20.12
Travel
Axis Travel (X/Z)
15.75″/15.75″
Guide ways
Box Guide
Rapid Traverse Rate (X/Z)
944.89/1,181.11 inch/min
Grinding Spindle
Spindle Speed
6,000 rpm
Spindle Motor (cont/max)
3.7/5.5 hp
Tool Shank Type
BBT40
Spindle Lubrication and Cooling
Grease encapsulation
ATC (Optional)
Max Number of Tools
2
Tool Change Method
Double Arm Swing
General
Floor Space (L×W)
113.75″ x 71.11″
Machine Weight A [B]
7,936 lbs.
Controller
Fanuc 0i-TF+
Specifications subject to change without notice.